With the advancement of state-of-the-art technologies, the semiconductor industry plays a key role as an essential component in the manufacture of various electronic products. Since the manufacturing of a semiconductor goes through very sophisticated and complex processes, efficient and accurate work and management are essential in the design, construction, and operation stages of the semiconductor fabrication (FAB) plant. Recently, the combined application of building information modeling (BIM) and augmented reality (AR) technology has gained increased attention in this semiconductor FAB industry as an advanced way to improve work efficiency and accuracy while eliminating other related problems, such as human errors. Despite the perceived benefits of combined use of BIM and AR, many technical problems still exist when integrating the target test model and the 3D virtual object model using BIM data and existing AR visualization technology, due to the unique characteristics of the FAB sites. To solve these problems, this study proposed an AR-based real-time BIM data compatibility verification method for future FAB digital twin implementation and demonstrated that it could be converted into a system and applied to actual FAB sites. As a result of the development and verification of this system, the proposed AR-based real-time BIM data compatibility verification system enables the accurate fitting of the AR model and actual object through AR tracking and anchoring technology considering the characteristics of FAB sites. After the fitting, the system was able to maintain compatibility, even when the camera moved and the marker moved away from the screen. By expanding the effective distance of compatibility between the AR model and the actual object, it was possible to increase the AR application range between the 3D virtual object model and the test target model and to improve the compatibility. © 2023 by the authors.

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